On Tuesday, G.Skill unveiled its latest innovation: ultra-low-latency DDR5-6400 memory modules, sporting a standout CAS latency of 30 clocks. This groundbreaking feature sets a new benchmark for DDR5-6400 sticks, available for users with either AMD or Intel CPUs.
Each new DDR memory generation brings a boost in data transfer rates, but also tends to stretch relative latencies. In most cases, the surging bandwidth helps counterbalance any performance dips due to higher timings. Yet, certain applications thrive on lower latencies, making the pursuit of reduced latencies a challenging but desirable feat. It’s often more complex to cut down on latency than to pump up data transfer speeds, which is why you don’t see low-latency modules popping up every day.
Despite these challenges, G.Skill has skillfully curated a selection of DDR5 memory chips and crafted the ideal printed circuit boards to introduce DDR5-6400 modules with CL30 timings. This is a notable improvement over the CL46 timings typically suggested by JEDEC for this speed category. To put this in perspective, while JEDEC-standard modules exhibit an absolute latency of 14.375 nanoseconds, G.Skill’s version impressively cuts that down to 9.375 nanoseconds, achieving roughly a 35% reduction.
These DDR5-6400 CL30 39-39-102 modules have a storage capacity of 16 GB and will be offered as 32 GB dual-channel kits. Details about voltages remain under wraps, though they are anticipated to be higher than the JEDEC standards.
These innovative modules are set to benefit both worlds: for the AMD crowd, they’ll feature EXPO profiles in models like the Trident Z5 Neo RGB and Trident Z5 Royal Neo; for Intel enthusiasts, XMP 3.0 profiles will be available, covering models such as the Trident Z5 RGB and Trident Z5 Royal. Particularly advantageous for AMD’s newest Ryzen 7000 and 9000-series processors, these modules address the AM5 systems’ typical 6000 MT/s to 6400 MT/s limitation, aligning with AMD’s Infinity Fabric’s operational cap at a 1:1 ratio.
It’s worth noting, the distinct nature of G.Skill’s modules means they’re tailored for high-end setups. They require motherboards that can handle their specifications and CPUs that are adequately cooled.
Expect these cutting-edge memory kits to hit the global market through G.Skill’s partners by late August 2024. While pricing details are still under wraps, given their premium nature and unique features, we can anticipate a price tag that matches their elite status.
